Signal integrity and crosstalk are issues of paramount importance in the design of high speed printed circuit boards. A new technology has been developed by several manufacturers in order to reduce problems related to the realization of multilayered structures. An accurate analysis method is presented to analyze such structures.

Signal Integrity and Crosstalk Analysis for Discrete Wire Technology PCBs / Araneo, Rodolfo; Celozzi, Salvatore; A., Orlandi. - STAMPA. - 1:(2000), pp. 469-654. (Intervento presentato al convegno EMC Europe 2000, 4th European Symposium on Electromagnetic Compatibility tenutosi a Brugge nel 11-15 Settembre 2000).

Signal Integrity and Crosstalk Analysis for Discrete Wire Technology PCBs

ARANEO, Rodolfo;CELOZZI, Salvatore;
2000

Abstract

Signal integrity and crosstalk are issues of paramount importance in the design of high speed printed circuit boards. A new technology has been developed by several manufacturers in order to reduce problems related to the realization of multilayered structures. An accurate analysis method is presented to analyze such structures.
2000
EMC Europe 2000, 4th European Symposium on Electromagnetic Compatibility
SIGNAL INTEGRITY
04 Pubblicazione in atti di convegno::04b Atto di convegno in volume
Signal Integrity and Crosstalk Analysis for Discrete Wire Technology PCBs / Araneo, Rodolfo; Celozzi, Salvatore; A., Orlandi. - STAMPA. - 1:(2000), pp. 469-654. (Intervento presentato al convegno EMC Europe 2000, 4th European Symposium on Electromagnetic Compatibility tenutosi a Brugge nel 11-15 Settembre 2000).
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11573/57968
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