The analysis of the current distribution on ground planes of printed circuit boards is carried out by means of dual approach. The current density inside ground planes of finite thickness is determined analytically. The per unit length parameters are evaluated. The results obtained by this method are compared with those deriving by a standard numerical procedure. The agreement was excellent with a considerable saving in computational time. New analytical expressions are proposed for the analysis of thick ground planes of finite conductivity.
General approach for the analysis of finite size PCB ground planes / Celozzi, Salvatore; Panariello, G.; Schettino, F.; Verolino, L.. - STAMPA. - (2000), pp. 357-362. (Intervento presentato al convegno IEEE International Symposium on Electromagnetic Compatibility tenutosi a Washington DC nel 21-25 Aug 2000) [10.1109/ISEMC.2000.875593].
General approach for the analysis of finite size PCB ground planes
CELOZZI, Salvatore;
2000
Abstract
The analysis of the current distribution on ground planes of printed circuit boards is carried out by means of dual approach. The current density inside ground planes of finite thickness is determined analytically. The per unit length parameters are evaluated. The results obtained by this method are compared with those deriving by a standard numerical procedure. The agreement was excellent with a considerable saving in computational time. New analytical expressions are proposed for the analysis of thick ground planes of finite conductivity.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
