Characterization of 205 and 206 copper alloys for space and ground applications

Cu-Ni-Si alloys are widely used for electrical applications because of their interesting combination of high strength and high electrical conductivity. They are utilized in several industrial sectors for producing, for example, resistance welding electrodes, plungers for die-casting, connectors, dies. They could be used for space applications, for example for the production of passive satellites where high density, good thermal conductivity and good mechanical properties are required. For common industrial applications, components made of these alloys are subjected to forging, extrusion or drawing followed by aging treatment. In this work, the mechanical behavior of alloys 205 and 206 has been investigated to evaluate the effect of solution heat treatment and aging. The results highlighted that small changes in the process parameters greatly affect the alloy mechanical response.