In this work we present a new design for a three-dimensional vibration energy harvester, which is made by Micro-Electro-Mechanical Systems (MEMS) technology, and which can convert electric energy through transverse mode piezoelectric effect. The presented power generator is based on a long, thick-film, piezoelectric beam configured as a conical helix structure and located between two metal electrodes. The design of the combined antenna/energy harvester (comvester, from communication and energy harvester) device addresses both electromagnetic and mechanical issues as it radiates electromagnetic energy and converts mechanical energy into electric energy. Both functions are translated directly into dimensional constraints of the structure. In this work, we concentrate on millimeter waves communications in the 60 GHz frequency band because of their availability for low-power CMOS radio circuits. In order to realize comvester on a silicon wafer we used Controlled Release Metal Layer (CRML) technology, which is a transfer layer technology that uses porous silicon as sacrificial material. The advantage of CRML technology is high repeatability and resolution and its compatibility with back-end of line processes of the integrated circuit industry. New type of piezoelectric material consisted of the array of separated vertical polyvinylidene fluoride (PVDF) microrods is suggested. Such periodic microrods structure became possible to realize using the template of the structured macroporous silicon. © 2013 IEEE.

3D Antenna for GHz application and vibration energy harvesting / Kholostov, Konstantin; Nenzi, Paolo; Palma, Fabrizio; Balucani, Marco. - STAMPA. - 2013:(2013), pp. 2018-2023. (Intervento presentato al convegno 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 tenutosi a Las Vegas; USA) [10.1109/ectc.2013.6575856].

3D Antenna for GHz application and vibration energy harvesting

KHOLOSTOV, KONSTANTIN;NENZI, Paolo;PALMA, Fabrizio;BALUCANI, Marco
2013

Abstract

In this work we present a new design for a three-dimensional vibration energy harvester, which is made by Micro-Electro-Mechanical Systems (MEMS) technology, and which can convert electric energy through transverse mode piezoelectric effect. The presented power generator is based on a long, thick-film, piezoelectric beam configured as a conical helix structure and located between two metal electrodes. The design of the combined antenna/energy harvester (comvester, from communication and energy harvester) device addresses both electromagnetic and mechanical issues as it radiates electromagnetic energy and converts mechanical energy into electric energy. Both functions are translated directly into dimensional constraints of the structure. In this work, we concentrate on millimeter waves communications in the 60 GHz frequency band because of their availability for low-power CMOS radio circuits. In order to realize comvester on a silicon wafer we used Controlled Release Metal Layer (CRML) technology, which is a transfer layer technology that uses porous silicon as sacrificial material. The advantage of CRML technology is high repeatability and resolution and its compatibility with back-end of line processes of the integrated circuit industry. New type of piezoelectric material consisted of the array of separated vertical polyvinylidene fluoride (PVDF) microrods is suggested. Such periodic microrods structure became possible to realize using the template of the structured macroporous silicon. © 2013 IEEE.
2013
2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
back-end of line process; integrated circuit industries; micro electromechanical system (mems); polyvinylidene fluorides; sacrificial material; three-dimensional vibrations; transverse mode piezoelectric; vibration energy harvesting
04 Pubblicazione in atti di convegno::04b Atto di convegno in volume
3D Antenna for GHz application and vibration energy harvesting / Kholostov, Konstantin; Nenzi, Paolo; Palma, Fabrizio; Balucani, Marco. - STAMPA. - 2013:(2013), pp. 2018-2023. (Intervento presentato al convegno 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 tenutosi a Las Vegas; USA) [10.1109/ectc.2013.6575856].
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11573/530704
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