An embodiment of a process of manufacturing an interconnection element for contacting electronic devices is proposed. The process starts with the step of forming a plurality of leads on a main surface of a first substrate; each lead has a first end and a second end. The second end of each lead is coupled with a second substrate. The second substrate and the first substrate are then spaced apart, so as to extend the leads between the first substrate and the second substrate. The process also includes the step of treating the main surface before forming the leads to control an adhesion of the leads on the main surface.

Interconnection of electronic devices with raised leads / Balucani, Marco. - (2011).

Interconnection of electronic devices with raised leads

BALUCANI, Marco
2011

Abstract

An embodiment of a process of manufacturing an interconnection element for contacting electronic devices is proposed. The process starts with the step of forming a plurality of leads on a main surface of a first substrate; each lead has a first end and a second end. The second end of each lead is coupled with a second substrate. The second substrate and the first substrate are then spaced apart, so as to extend the leads between the first substrate and the second substrate. The process also includes the step of treating the main surface before forming the leads to control an adhesion of the leads on the main surface.
2011
05 Brevetto::05a Brevetto
Interconnection of electronic devices with raised leads / Balucani, Marco. - (2011).
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11573/502880
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