The chemical modification of a polyalkylene-polyamine by reaction with phenol and formaldehyde allowed the obtainment of a series of curing agents tailored for an epoxy formulation suitable for the conformal coating of electronic assemblies. The mechanical, physical and above all electrical properties and durability of the coatings were measured; the presence of inorganic fillers (quartz and mica) into the formulation was also experimented with satisfactory results.
Modified-amine cured epoxy formulation for the encapsulation of electronic circuits / Rinaldi, Gilberto; G., Rubini; D., Surace. - In: JOURNAL OF MICROELECTRONICS AND ELECTRONIC PACKAGING. - ISSN 1551-4897. - STAMPA. - 2 (1):(2005), pp. 55-63.
Modified-amine cured epoxy formulation for the encapsulation of electronic circuits
RINALDI, Gilberto;
2005
Abstract
The chemical modification of a polyalkylene-polyamine by reaction with phenol and formaldehyde allowed the obtainment of a series of curing agents tailored for an epoxy formulation suitable for the conformal coating of electronic assemblies. The mechanical, physical and above all electrical properties and durability of the coatings were measured; the presence of inorganic fillers (quartz and mica) into the formulation was also experimented with satisfactory results.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
