We report the building procedure of X-band copper structures using the electroforming and electroplating techniques. These techniques allow the deposition of copper layers on a suitable die and they can be used to build RF structures avoiding the high temperature brazing step in the standard technique. We show the constructed prototypes and low power RF measurements and discuss the results of the high power tests at SLAC National Accelerator Laboratory. (C) 2011 Published by Elsevier B.V.
High-power comparison among brazed, clamped and electroformed X-band cavities / B., Spataro; D., Alesini; V., Chimenti; V., Dolgashev; Y., Higashi; Migliorati, Mauro; Mostacci, Andrea; R., Parodi; S. g., Tantawi; A. d., Yeremian. - In: NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH. SECTION A, ACCELERATORS, SPECTROMETERS, DETECTORS AND ASSOCIATED EQUIPMENT. - ISSN 0168-9002. - 657:1(2011), pp. 88-93. [10.1016/j.nima.2011.06.047]
High-power comparison among brazed, clamped and electroformed X-band cavities
MIGLIORATI, Mauro;MOSTACCI, Andrea;
2011
Abstract
We report the building procedure of X-band copper structures using the electroforming and electroplating techniques. These techniques allow the deposition of copper layers on a suitable die and they can be used to build RF structures avoiding the high temperature brazing step in the standard technique. We show the constructed prototypes and low power RF measurements and discuss the results of the high power tests at SLAC National Accelerator Laboratory. (C) 2011 Published by Elsevier B.V.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
