In this contribution we report on the application of the Bending Beam Method (BBM) and the Probe Deflection Beam (PDB) as non destructive tools for the in-situ characterization of electrode materials and electrochemical processes. The systems under investigation usually possess a thin film configuration with thickness values ranging between 0.1 and 100 um. the detection of the probing laser beam displacement can be then exploited for the evaluation of the mechanical stress in thin film electrodes with BBM, or for the identification of the actual species flowing to/from the electrode with PBD technique. The PBD and BBM characterization of some electrochemical processes will be here presented.

Non-invasive in-situ techniques fof the characterization of processes at thin film electrodes / Dini, Danilo; Decker, Franco. - STAMPA. - 497:(1999), pp. 309-314.

Non-invasive in-situ techniques fof the characterization of processes at thin film electrodes

DINI, DANILO;DECKER, Franco
1999

Abstract

In this contribution we report on the application of the Bending Beam Method (BBM) and the Probe Deflection Beam (PDB) as non destructive tools for the in-situ characterization of electrode materials and electrochemical processes. The systems under investigation usually possess a thin film configuration with thickness values ranging between 0.1 and 100 um. the detection of the probing laser beam displacement can be then exploited for the evaluation of the mechanical stress in thin film electrodes with BBM, or for the identification of the actual species flowing to/from the electrode with PBD technique. The PBD and BBM characterization of some electrochemical processes will be here presented.
1999
04 Pubblicazione in atti di convegno::04b Atto di convegno in volume
Non-invasive in-situ techniques fof the characterization of processes at thin film electrodes / Dini, Danilo; Decker, Franco. - STAMPA. - 497:(1999), pp. 309-314.
File allegati a questo prodotto
Non ci sono file associati a questo prodotto.

I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11573/385559
 Attenzione

Attenzione! I dati visualizzati non sono stati sottoposti a validazione da parte dell'ateneo

Citazioni
  • ???jsp.display-item.citation.pmc??? ND
  • Scopus ND
  • ???jsp.display-item.citation.isi??? ND
social impact