In this contribution we report on the application of the Bending Beam Method (BBM) and the Probe Deflection Beam (PDB) as non destructive tools for the in-situ characterization of electrode materials and electrochemical processes. The systems under investigation usually possess a thin film configuration with thickness values ranging between 0.1 and 100 um. the detection of the probing laser beam displacement can be then exploited for the evaluation of the mechanical stress in thin film electrodes with BBM, or for the identification of the actual species flowing to/from the electrode with PBD technique. The PBD and BBM characterization of some electrochemical processes will be here presented.
Non-invasive in-situ techniques fof the characterization of processes at thin film electrodes / Dini, Danilo; Decker, Franco. - STAMPA. - 497:(1999), pp. 309-314.
Non-invasive in-situ techniques fof the characterization of processes at thin film electrodes
DINI, DANILO;DECKER, Franco
1999
Abstract
In this contribution we report on the application of the Bending Beam Method (BBM) and the Probe Deflection Beam (PDB) as non destructive tools for the in-situ characterization of electrode materials and electrochemical processes. The systems under investigation usually possess a thin film configuration with thickness values ranging between 0.1 and 100 um. the detection of the probing laser beam displacement can be then exploited for the evaluation of the mechanical stress in thin film electrodes with BBM, or for the identification of the actual species flowing to/from the electrode with PBD technique. The PBD and BBM characterization of some electrochemical processes will be here presented.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.