Compliant interconnect technology for power modules in automotive applications

This work presents a new bond-less and economic viable, technology for power dice interconnection in power modules for automotive applications. In the presented technology bond wires, the major cause of module failures, are replaced by compliant contacts embedded in a polymer core that are pressed, at a prescribed force, over the power dice to establish and maintain a stable low-resistance electrical contact. The absence of rigid bonds, or solder joints, over the silicon die eliminates the failures caused by the mechanical stress induced by the mismatch in thermal expansion coefficients of aluminum wires and silicon. The contacting structures are curved metal wires plated onto a silicon wafer that are bonded to a signal redistribution layer, extruded and embedded into a polymer. This technology can reduce the footprint of power modules. Control circuits can be built over the power dice, with the added value of reducing parasitic effects. Designed test vehicle are presented.