An improved extraction procedure is here proposed to carry out shielded cable macro-model suitable to be implemented in any SPICE based circuit simulator. The proposed procedure permits to account frequency-dependent losses as skin effect, and frequency-dependent behaviour of the transfer impedance. The shielded cable is modelled by a four-port network with lumped time-constant parameters obtained by applying the proposed improved fitting technique. The proposed macro-model is validated by comparing the results with those obtained by measurements.

New extraction procedure of shielded cable SPICE macro-model for the prediction of signal integrity and conducted immunity / Araneo, Rodolfo; S., Caniggia; Maradei, Francescaromana. - STAMPA. - 3:(2006), pp. 751-755. (Intervento presentato al convegno IEEE Symposium on Electromagnetic Compatibility tenutosi a Portland (OR), USA nel Aug. 14-18, 2006) [10.1109/ISEMC.2006.1706410].

New extraction procedure of shielded cable SPICE macro-model for the prediction of signal integrity and conducted immunity

ARANEO, Rodolfo;MARADEI, Francescaromana
2006

Abstract

An improved extraction procedure is here proposed to carry out shielded cable macro-model suitable to be implemented in any SPICE based circuit simulator. The proposed procedure permits to account frequency-dependent losses as skin effect, and frequency-dependent behaviour of the transfer impedance. The shielded cable is modelled by a four-port network with lumped time-constant parameters obtained by applying the proposed improved fitting technique. The proposed macro-model is validated by comparing the results with those obtained by measurements.
2006
IEEE Symposium on Electromagnetic Compatibility
Circuit extraction; conducted immunity; shielded cable; signal integrity.
04 Pubblicazione in atti di convegno::04b Atto di convegno in volume
New extraction procedure of shielded cable SPICE macro-model for the prediction of signal integrity and conducted immunity / Araneo, Rodolfo; S., Caniggia; Maradei, Francescaromana. - STAMPA. - 3:(2006), pp. 751-755. (Intervento presentato al convegno IEEE Symposium on Electromagnetic Compatibility tenutosi a Portland (OR), USA nel Aug. 14-18, 2006) [10.1109/ISEMC.2006.1706410].
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11573/194304
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