Medium and high phosphorous Ni-P coatings obtained via an electroless approach. Optimization of solution formulation and characterization of coatings

A new lead-free electroless Ni-P plating solution was developed for the deposition of coatings with medium phosphorus content (MP, 6-9 wt%), and its composition was optimized to obtain deposits with high phosphorus (HP, 10-14 wt%). Cleaning and activation treatments were studied in terms of effectiveness and influence on the deposition rate. The concentration of reagents (nickel salt, complexing agent, reducing agent and stabilizer) was studied, and their combined effect on P content and plating rate was investigated. The obtained coatings were analyzed by SEM and XRD and thermally treated at 400 degrees C and 600 degrees C to study microstructural evolution. Vickers hardness was measured on as-deposited and annealed coatings to relate hardness evolution to microstructural changes after thermal treatments. Optimal deposition conditions were determined, enabling the production of MP coatings (6.5 wt% P) with a plating rate of 40 mu m/h and HP coatings (10.9 wt% P) with a plating rate of 25 mu m/h at 90 degrees C. Samples heat-treated at 400 degrees C showed improved hardness thanks to crystallization and microprecipitation of Ni3P hard phases, whereas hardness decrease was observed after treatment at 600 degrees C due to the combined effect of grain growth and coarsening of Ni3P precipitates. No through-the-thickness cracks were detected by the Ferroxyl reagent after heat treatments.