A method is described for the preparation of device-quality, nearly flat, terraced, hydrogen-terminated, (100) silicon. The method requires heating at high temperature (say, 1100 °C) in H2, cooling to moderate temperature (670-700 °C) in the same ambient, and quenching to room temperature in N2. Evidence that the process really results in the said surface is based on atomic force microscopy, infrared absorption spectroscopy in the attenuated total reflection mode, thermal programmed desorption, reflection high energy electron diffraction, and angle-resolved X-ray photoelectron spectroscopy.

Nearly flat, terraced, hydrogen terminated, 1x1 (100) silicon prepared by high temperature exposure to H2 / Cerofolini, G. F.; Galati, C; Giorgi, G; Motta, A; Reina, S; Renna, L; Terrasi, A. - In: APPLIED PHYSICS. A, MATERIALS SCIENCE & PROCESSING. - ISSN 0947-8396. - 81:(2005), pp. 745-751. [10.1007/s00339-004-3087-y]

Nearly flat, terraced, hydrogen terminated, 1x1 (100) silicon prepared by high temperature exposure to H2

MOTTA A;
2005

Abstract

A method is described for the preparation of device-quality, nearly flat, terraced, hydrogen-terminated, (100) silicon. The method requires heating at high temperature (say, 1100 °C) in H2, cooling to moderate temperature (670-700 °C) in the same ambient, and quenching to room temperature in N2. Evidence that the process really results in the said surface is based on atomic force microscopy, infrared absorption spectroscopy in the attenuated total reflection mode, thermal programmed desorption, reflection high energy electron diffraction, and angle-resolved X-ray photoelectron spectroscopy.
2005
Atomic force microscopy; Binding energy; Electromagnetic wave attenuation; High energy electron diffraction;
01 Pubblicazione su rivista::01a Articolo in rivista
Nearly flat, terraced, hydrogen terminated, 1x1 (100) silicon prepared by high temperature exposure to H2 / Cerofolini, G. F.; Galati, C; Giorgi, G; Motta, A; Reina, S; Renna, L; Terrasi, A. - In: APPLIED PHYSICS. A, MATERIALS SCIENCE & PROCESSING. - ISSN 0947-8396. - 81:(2005), pp. 745-751. [10.1007/s00339-004-3087-y]
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11573/1657864
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