Preliminary low-frequency dielectric measurement of 3D printed materials

Nowadays, Fused Deposition Modeling represents the most common method used in the 3D-printing process, and it is based on thermoplastic materials extrusion. With the introduction on the market of increasingly particular filaments (such as conductive, rubbery, wooden doped), the study of the dielectric property had become a necessity, mainly when these filaments were used as support for integrated 3dprinted sensors, circuits or devices. This paper presents a preliminary study of dielectric measurement at the low frequency of wo different polymeric materials, poly-lactic acid (PLA) and High Impact PolyStyrene (HIPS), commonly used in additive manufacturing. Ten samples at 5 different infill percentages were ealized for each material. The dielectric permittivity in the range 10 Hz to 100 kHz was evaluated. A capacitive probe with an accuracy of 2% was realized and applied. As a result, an R2 of 0.99 shows how the dose-response curve represents the graduation curve between infill percentage and relative permittivity.