The original design of a new 144-cell concentrating photovoltaic assembly is presented in this paper. It is conceived to work under 500 suns and to generate about 2.5 kWe. An insulated metal substrate was selected as baseplate, in order to get the best compromise between costs and thermal performances. It is based on a 2mm thick aluminum plate, which is in charge of removing the heat as quick as possible. The copper pattern and thickness has been designed accordingly to the IPC Generic Standard on Printed Board Design and to the restrictions of fit a reflective 125x primary optics and a 4x secondary refractive optics. The original outline of the conductive copper layer has been developed to minimize Joule losses by reducing the number of interconnections between the cells in series. Multijunction solar cells and Schottky bypass diodes have been soldered onto the board as surface mounted components. All the fabrication processes are described. This board represents a novelty for the innovative pattern of the conductive layer, which can be easily adapted to be coupled with different optics geometries and to allocate a different number of cells. The use of an IMS as baseplate will give an experimental contribution to the debate about the exploitability of this kind of substrates in CPV. This board is being characterized indoor and outdoor: the results will be used to improve the design and the reliability of the future receivers.

Design and production of a 2.5 kWe insulated metal substrate-based densely packed CPV assembly / Micheli, L.; Sarmah, N.; Luo, X.; Reddy, K. S.; Mallick, T. K.. - 1616:(2014), pp. 196-199. (Intervento presentato al convegno 10th International Conference on Concentrator Photovoltaic Systems, CPV 2014 tenutosi a Albuquerque, NM, USA) [10.1063/1.4897059].

Design and production of a 2.5 kWe insulated metal substrate-based densely packed CPV assembly

Micheli L.;
2014

Abstract

The original design of a new 144-cell concentrating photovoltaic assembly is presented in this paper. It is conceived to work under 500 suns and to generate about 2.5 kWe. An insulated metal substrate was selected as baseplate, in order to get the best compromise between costs and thermal performances. It is based on a 2mm thick aluminum plate, which is in charge of removing the heat as quick as possible. The copper pattern and thickness has been designed accordingly to the IPC Generic Standard on Printed Board Design and to the restrictions of fit a reflective 125x primary optics and a 4x secondary refractive optics. The original outline of the conductive copper layer has been developed to minimize Joule losses by reducing the number of interconnections between the cells in series. Multijunction solar cells and Schottky bypass diodes have been soldered onto the board as surface mounted components. All the fabrication processes are described. This board represents a novelty for the innovative pattern of the conductive layer, which can be easily adapted to be coupled with different optics geometries and to allocate a different number of cells. The use of an IMS as baseplate will give an experimental contribution to the debate about the exploitability of this kind of substrates in CPV. This board is being characterized indoor and outdoor: the results will be used to improve the design and the reliability of the future receivers.
2014
10th International Conference on Concentrator Photovoltaic Systems, CPV 2014
assembly; high concentration; insulated metal substrate; thermal management
04 Pubblicazione in atti di convegno::04b Atto di convegno in volume
Design and production of a 2.5 kWe insulated metal substrate-based densely packed CPV assembly / Micheli, L.; Sarmah, N.; Luo, X.; Reddy, K. S.; Mallick, T. K.. - 1616:(2014), pp. 196-199. (Intervento presentato al convegno 10th International Conference on Concentrator Photovoltaic Systems, CPV 2014 tenutosi a Albuquerque, NM, USA) [10.1063/1.4897059].
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11573/1625595
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