The 20th IEEE International Conference on Dielectric Liquids (ICDL 2019), chaired by Massimo Pompili, was held from June 23 to 27, 2019, hosted by the Faculty of Engineering of University of Roma "La Sapienza". The ICDL 2019 is fully sponsored by the IEEE Dielectrics and Electrical Insulation Society (DEIS), supported by Cargill, Fratelli Parodi, Midel, Baur, Ekofluid, Ergon, Haefely Hipotronics, IET, Nynas, Omicron and Sea Marconi. The conference was chaired by Massimo Pompili in collaboration with Technical Program Chair Luigi Calcara and the Italian CEI (Comitato Elettrotecnico Italiano)
Report on ICDL 2019. University of Roma "la Sapienza," Rome, Italy, June 23 27, 2019 / Pompili, M.; Calcara, L.. - In: IEEE ELECTRICAL INSULATION MAGAZINE. - ISSN 0883-7554. - 35:6(2019), pp. 64-65. (Intervento presentato al convegno 20th IEEE International Conference on Dielectric Liquids. ICDL 2019 tenutosi a Rome; Italy) [10.1109/MEI.2019.8878265].
Report on ICDL 2019. University of Roma "la Sapienza," Rome, Italy, June 23 27, 2019
Pompili M.;Calcara L.
2019
Abstract
The 20th IEEE International Conference on Dielectric Liquids (ICDL 2019), chaired by Massimo Pompili, was held from June 23 to 27, 2019, hosted by the Faculty of Engineering of University of Roma "La Sapienza". The ICDL 2019 is fully sponsored by the IEEE Dielectrics and Electrical Insulation Society (DEIS), supported by Cargill, Fratelli Parodi, Midel, Baur, Ekofluid, Ergon, Haefely Hipotronics, IET, Nynas, Omicron and Sea Marconi. The conference was chaired by Massimo Pompili in collaboration with Technical Program Chair Luigi Calcara and the Italian CEI (Comitato Elettrotecnico Italiano)| File | Dimensione | Formato | |
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