Detection system based on a novel large area hybrid detector

A system level implementation of a large area hybrid detector is presented. The detector used in this system consists of an array of hydrogenated amorphous silicon photodiodes directly connected to a CMOS readout chip, which is vertically integrated over the sensor array using flip-chip bonding. In particular, the proposed solution relies on a stack of interconnection layers, deposited on top of the photodiode array, to route each individual pixel output to a separate pre-amplifier channel. This avoids the need for a geometrical matching between the sensor array and the chip contact pads. As a consequence, conventional non-pixelated readout chip can be used and easy-scalable large area detectors can be produced. The CMOS chip is connected to an electronic board, providing the interfaces needed to read the signals as well as providing voltage references and power to the chip. The signals are collected and pre-processed by an FPGA chip, providing a very compact and flexible setup. (C) 2010 Elsevier Ltd. All rights reserved.