Modeling Interconnects Discontinuities in the Wavelet Domain

The extraction of equivalents of lumped discontinuities in common printed circuit boards (PCBs) is a key topic in the study of wave propagation of high-speed signals along interconnects, since these irregularities pose several signal integrity (SI) and electromagnetic interference (EMI) problems. In the past, much research has focused on modeling such discontinuities by means of appropriate lumped equivalent circuits, suitable to be used in transient circuit simulators, either starting from reasonable physical observations or simply applying fitting techniques on full-wave numerical data [1]. In this paper a novel technique is presented for the extraction of two-port equivalents in the wavelet-domain, which has been proved to be an efficient and powerful tool for the analysis of transmission lines and interconnects [2]. The wavelet-transformed scattering parameters of the discontinuities are included in a wavelet equivalent of TEM wave propagation paths along the PCB in order to obtain an overall equivalent of the whole structure under investigation.