This works presents a new MEMS technology for the realization of 3D wire micro-antennas that can be integrated into integrated circuit (IC) packages by means of a layer transfer process. Single antennas or phased arrays are realized as planar structures by metal deposition onto a host silicon wafer over porous silicon areas. The host wafer is then bonded of the IC wafer (over the top metal layer) employing standard wafer-to-wafer bonding processes. The antennas are extruded by pulling the two wafers apart, releasing the metal, and kept in position by injecting a polymer in the gap between the wafers. Host wafer is the de-bonded and the polymer-embedded antennas are exposed. Spiral conical antennas have been designed to operate in the 60 GHz to 1 THz frequency ranges to validate the technology. The characteristics of the antennas and of a 16x16 phased square array operating at 960 GHz have been simulated and results are shown.
μ-Helix 3D-antenna technology / Nenzi, Paolo; Tripaldi, F.; Marzano, F. S.; Palma, F.; Balucani, Marco. - 2:(2011), pp. 434-437. (Intervento presentato al convegno Nanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011 tenutosi a Boston; United States nel 13 June 2011 through 16 June 2011).
μ-Helix 3D-antenna technology
NENZI, Paolo;F. Palma;BALUCANI, Marco
2011
Abstract
This works presents a new MEMS technology for the realization of 3D wire micro-antennas that can be integrated into integrated circuit (IC) packages by means of a layer transfer process. Single antennas or phased arrays are realized as planar structures by metal deposition onto a host silicon wafer over porous silicon areas. The host wafer is then bonded of the IC wafer (over the top metal layer) employing standard wafer-to-wafer bonding processes. The antennas are extruded by pulling the two wafers apart, releasing the metal, and kept in position by injecting a polymer in the gap between the wafers. Host wafer is the de-bonded and the polymer-embedded antennas are exposed. Spiral conical antennas have been designed to operate in the 60 GHz to 1 THz frequency ranges to validate the technology. The characteristics of the antennas and of a 16x16 phased square array operating at 960 GHz have been simulated and results are shown.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
