Through-hole vias made of multiwall carbon nanotubes (MWCNTs) are simulated using the multiconductor and equivalent single conductor models. The circuit approach is developed in order to define an equivalent lumped-parameter SPICE-model. Different expressions of the p.u.l. damping quantum resistance are considered and their impact on the prediction of the via performance at high frequency is discussed. The frequency spectra of the input impedance and of the current transfer function of nano-vias with different length are computed in the frequency range up to 100 GHz. © 2010 IEEE.
SPICE-model of multiwall carbon nanotube through-hole vias / D'Amore, Marcello; Sarto, Maria Sabrina; Tamburrano, Alessio. - STAMPA. - (2010), pp. 1104-1107. (Intervento presentato al convegno 2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010 tenutosi a Beijing nel 12 April 2010 through 16 April 2010) [10.1109/apemc.2010.5475597].
SPICE-model of multiwall carbon nanotube through-hole vias
D'AMORE, Marcello;SARTO, Maria Sabrina;TAMBURRANO, Alessio
2010
Abstract
Through-hole vias made of multiwall carbon nanotubes (MWCNTs) are simulated using the multiconductor and equivalent single conductor models. The circuit approach is developed in order to define an equivalent lumped-parameter SPICE-model. Different expressions of the p.u.l. damping quantum resistance are considered and their impact on the prediction of the via performance at high frequency is discussed. The frequency spectra of the input impedance and of the current transfer function of nano-vias with different length are computed in the frequency range up to 100 GHz. © 2010 IEEE.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
