NENZI, Paolo
 Distribuzione geografica
Continente #
NA - Nord America 2.051
EU - Europa 942
AS - Asia 241
SA - Sud America 14
AF - Africa 12
OC - Oceania 3
Totale 3.263
Nazione #
US - Stati Uniti d'America 1.981
IT - Italia 245
GB - Regno Unito 154
SE - Svezia 150
IN - India 126
DE - Germania 93
CN - Cina 88
FI - Finlandia 78
UA - Ucraina 74
FR - Francia 72
CA - Canada 70
IE - Irlanda 15
AR - Argentina 14
AT - Austria 14
TG - Togo 11
BG - Bulgaria 10
SG - Singapore 8
RU - Federazione Russa 7
BE - Belgio 6
RO - Romania 6
CH - Svizzera 5
HK - Hong Kong 5
BY - Bielorussia 4
IR - Iran 4
NL - Olanda 4
PT - Portogallo 4
TR - Turchia 4
AU - Australia 2
KR - Corea 2
GR - Grecia 1
IL - Israele 1
KG - Kirghizistan 1
MY - Malesia 1
NZ - Nuova Zelanda 1
VN - Vietnam 1
ZA - Sudafrica 1
Totale 3.263
Città #
Fairfield 332
Ashburn 216
Chandler 179
Woodbridge 128
Houston 123
Rome 123
Seattle 119
Cambridge 101
Wilmington 96
Munich 85
Beijing 67
Ann Arbor 64
Princeton 63
Plano 58
Mcallen 51
Montréal 48
San Paolo di Civitate 44
Lawrence 36
Boston 28
Millbury 27
Helsinki 24
San Diego 24
Pune 19
Dearborn 18
Dublin 15
Toronto 15
Andover 14
Federal 13
New York 13
Vienna 13
Lomé 11
Des Moines 10
Sofia 10
Jacksonville 8
Ottawa 7
Southend 7
Brussels 6
Cagliari 6
Fasano 6
Norwalk 6
Falls Church 5
Indiana 5
Milan 5
Nanjing 5
Châtenay-malabry 4
Frascati 4
Giugliano In Campania 4
Hong Kong 4
Redwood City 4
San Mateo 4
Boardman 3
Geneva 3
Istanbul 3
Nizhniy Novgorod 3
Paris 3
Porto 3
Tehran 3
Augusta 2
Bühl 2
Canale Monterano 2
Florence 2
Hefei 2
Kraskovo 2
London 2
Nahe 2
Orlando 2
Porto Ceresio 2
Redmond 2
San Francisco 2
Singapore 2
Sydney 2
Taviano 2
Yellow Springs 2
Amsterdam 1
Aprilia 1
Auburn Hills 1
Basking Ridge 1
Bishkek 1
Boise 1
Bracciano 1
Buffalo 1
Campobasso 1
Changchun 1
Changsha 1
Chicago 1
Ciampino 1
Comodoro Rivadavia 1
Fucecchio 1
Grants Pass 1
Hangzhou 1
Hanoi 1
Harbin 1
Jinan 1
Jyväskylä 1
Kuala Lumpur 1
Kunming 1
Las Vegas 1
Latina 1
Lisbon 1
Los Angeles 1
Totale 2.357
Nome #
Design and technology for 3D MEMS device for vibration energy harvesting 389
Dosimetric characterization of an irradiation set-up for electronic components testing at the TOP-IMPLART proton linear accelerator 141
Aluminum-silicon interdiffusion in screen printed metal contacts for silicon based solar cells applications 104
3D Antenna for GHz application and vibration energy harvesting 81
60 GHz Tapered-Helix Antenna for WPAN Applications 78
High Density Compliant Contacting Technology for Integrated High Power Modules in Automotive Applications 78
High uniformity and high speed copper pillar plating technique 74
Smart flexible planar electrodes for electrochemotherapy and biosensing 70
Characterization of Copper Nanostructures Grown on Porous Silicon by Displacement Deposition 69
Proton beam spatial distribution and bragg peak imaging by photoluminescence of color centers in lithium fluoride crystals at the TOP-IMPLART linear accelerator 68
New selective wet processing 67
New selective processing technique for solar cells 67
Kinetostatic optimization of a MEMS-based compliant 3 DOF plane parallel platform 67
Editorial of the Special Issue of Microelectronics Journal on the IEEE International MOS-AK/GSA Workshop on Compact Modeling 2010 (MOS-AK/GSA Rome 2010) 67
Electric Field Enhancement in 3-D Tapered Helix Antenna for Terahertz Applications 65
Dielectric Lens Optimization for Conical Helix THz Antennas 65
Terahertz Sensor for Integrated Image Detector 64
Nano-klystron: New design and technology for THz source 64
Electrochemical and hydrothermal deposition of ZnO on silicon: from continuous films to nanocrystals 63
Visible photoluminescence of color centers in LiF crystals for advanced diagnostics of 18 and 27 MeV proton beams 61
Technology and design of innovative flexible electrode for biomedical applications 60
Electrochemically etched TSV for porous silicon interposer technologies 57
Transfer layer technology for the packaging of high power modules 56
First acceleration of a proton beam in a side coupled drift tube linac 55
Dynamic radiation testing on commercial integrated MEMS inertial navigation system with X-rays and electrons 55
First integration of MOSFET band-to-band-tunneling current in BSIM4 54
Cost of Ownership model for Probe Card Technology 53
ALL NPN SOLID STATE POWER CONTROLLER 53
Electrochemical Deposition and Characterization of Ni in Mesoporous Silicon 52
A novel PSS analysis implementation reusing the TRAN analysis of Ngspice circuit simulator 51
Immersion displacement deposition of copper on porous silicon for nanostructure fabrication 49
Comparative study of initial stages of copper immersion deposition on bulk and porous silicon 49
Nanostructures formed by displacement of porous silicon with copper: from nanoparticles to porous membranes 48
Gold in flux-less bonding: Noble or not noble 47
Optimization of Chemical Displacement Deposition of Copper on Porous Silicon 46
Electrochemical Deposition of Ni into Mesoporous Silicon 45
Nanostructured porous materials form Micro- and nano-electronics applications 44
Radiation testing for space applications at ENEA Frascati 35 MeV proton linear accelerator 43
Tin-Aluminium Metal Contact for Silicon Based Solar Cells 40
U-Helix: on-chip short conical antenna MEMS technology for millimeter-wave communication and imaging 40
Compliant interconnect technology for power modules in automotive applications 39
In Quest of a Reliable Method of Characterization of the Mechanical Properties of Silicon Micro-Robots 38
Attività sperimentali nell’ambito del Progetto TOP-IMPLART 37
Superhydrophobic porous silicon surfaces 35
New Industrial Selective Processing Technique for Solar Cell 33
EXPERIMENTAL ACTIVITY IN THE ENEA-FRASCATI IRRADIATION FACILITY WITH 3-7 MeV PROTONS 30
EXPERIMENTAL RESULTS ON SCDTL STRUCTURES FOR PROTONS 30
Investigation of macroporous silicon as a material for ultra-thin photovoltaic cells 29
Contributions in evaluating the statistical impact of technology variations on delay and power dissipation of logic cells 29
On-Chip THz 3D Antennas 29
Superhydrophobic porous silicon surfaces 29
Incorporation of Copper Nanoparticles into Porous Silicon 26
Superhydrophobic states on porous silicon 26
New approach for the monolithic integration of silicon photonics, integrated circuits and solar cell 26
Copper displacement deposition on nanostructured porous silicon 26
μ-Helix 3D-antenna technology 24
KLU sparse direct linear solver implementation into NGSPICE 18
Three-dimensional micro-antenna array for millimetre and sub-millimetre-wave remote imaging 16
New technology for metal nanorods formation 15
Reliability analysis of a new probe card technology 14
Exploring the ENEA Casaccia and ENEA Frascati irradiation capabilities: Status and perspectives 10
Totale 3.358
Categoria #
all - tutte 7.224
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 7.224


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2018/2019296 0 0 0 0 0 0 0 0 0 58 115 123
2019/2020781 109 23 9 26 66 67 94 73 85 100 80 49
2020/2021431 62 57 48 50 38 32 15 29 45 17 15 23
2021/2022601 8 47 56 18 79 19 15 58 52 55 76 118
2022/2023729 140 175 54 59 64 53 27 55 48 28 22 4
2023/2024283 14 35 9 27 31 90 5 56 2 14 0 0
Totale 3.358